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Contributed Review: Experimental characterization of inverse piezoelectric strain in GaN HEMTs via micro-Raman spectroscopy

机译:贡献回顾:通过微拉曼光谱实验表征GaN HEmT中的逆压电应变

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摘要

Micro-Raman thermography is one of the most popular techniques for measuring local temperature rise in gallium nitride (GaN) high electron mobility transistors with high spatial and temporal resolution. However, accurate temperature measurements based on changes in the Stokes peak positions of the GaN epitaxial layers require properly accounting for the stress and/or strain induced by the inverse piezoelectric effect. It is common practice to use the pinched OFF state as the unpowered reference for temperature measurements because the vertical electric field in the GaN buffer that induces inverse piezoelectric stress/strain is relatively independent of the gate bias. Although this approach has yielded temperature measurements that agree with those derived from the Stokes/anti-Stokes ratio and thermal models, there has been significant difficulty in quantifying the mechanical state of the GaN buffer in the pinched OFF state from changes in the Raman spectra. In this paper, we review the experimental technique of micro-Raman thermography and derive expressions for the detailed dependence of the Raman peak positions on strain, stress, and electric field components in wurtzite GaN. We also use a combination of semiconductor device modeling and electro-mechanical modeling to predict the stress and strain induced by the inverse piezoelectric effect. Based on the insights gained from our electro-mechanical model and the best values of material properties in the literature, we analyze changes in the E2 high and A1 (LO) Raman peaks and demonstrate that there are major quantitative discrepancies between measured and modeled values of inverse piezoelectric stress and strain. We examine many of the hypotheses offered in the literature for these discrepancies but conclude that none of them satisfactorily resolves these discrepancies. Further research is needed to determine whether the electric field components could be affecting the phonon frequencies apart from the inverse piezoelectric effect in wurtzite GaN, which has been predicted theoretically in zinc blende gallium arsenide (GaAs).
机译:显微拉曼热成像技术是用于测量具有高空间和时间分辨率的氮化镓(GaN)高电子迁移率晶体管中局部温度升高的最受欢迎的技术之一。但是,基于GaN外延层的斯托克斯峰位置的变化进行准确的温度测量需要适当考虑逆压电效应引起的应力和/或应变。通常的做法是使用夹断的OFF状态作为温度测量的无功率参考,因为GaN缓冲器中引起反向压电应力/应变的垂直电场相对独立于栅极偏置。尽管此方法产生的温度测量值与从斯托克斯/反斯托克斯比和热模型得出的结果一致,但是根据拉曼光谱的变化来量化处于夹断状态的GaN缓冲液的机械状态仍然存在很大困难。在本文中,我们回顾了显微拉曼热成像的实验技术,并得出了拉曼峰位置对纤锌矿型GaN中的应变,应力和电场分量的详细依赖性的表达式。我们还结合使用半导体器件建模和机电模型来预测逆压电效应引起的应力和应变。基于从我们的机电模型获得的见解和文献中材料性能的最佳值,我们分析了E2高峰和A1(LO)拉曼峰的变化,并证明了在实测值和模型值之间存在重大的定量差异。逆压电应力和应变。我们检查了文献中针对这些差异的许多假设,但得出的结论是,没有一个可以令人满意地解决这些差异。除了纤锌矿GaN中的逆压电效应以外,还需要进一步的研究来确定电场分量是否会影响声子频率,这在理论上已在锌混合砷化镓(GaAs)中进行了预测。

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